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1 diffusion metallization
Большой англо-русский и русско-английский словарь > diffusion metallization
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2 diffusion metallization
Англо-русский словарь технических терминов > diffusion metallization
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3 diffusion metallization
Техника: диффузионная металлизацияУниверсальный англо-русский словарь > diffusion metallization
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4 diffusion metallization
< srfc> ■ Diffusionsmetallisieren nEnglish-german technical dictionary > diffusion metallization
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5 diffusion metallization
metalizowanie dyfuzyjneEnglish-Polish dictionary for engineers > diffusion metallization
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6 diffusion metallization
Англо-русский словарь по машиностроению > diffusion metallization
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7 diffusion metallization
• металлизация f диффузионная -
8 metallization
1) металлизация2) рисунок металлизации; топология металлизации; структура металлизации•-
back surface metallization
-
cold metallization
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diffusion metallization
-
edge metallization
-
fine-line metallization
-
front surface metallization
-
galvanic metallization
-
Mft-off metallization
-
multilayer metallization
-
multilevel metallization
-
ohmic metallization
-
reverse-side metallization
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spark discharge metallization
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top-side metallization
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vacuum metallization -
9 диффузионная металлизация
Англо-русский словарь технических терминов > диффузионная металлизация
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10 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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11 process
1) процесс2) (технологический) процесс; (технологическая) обработка3) технологический приём; способ4) технология5) режим; ход (процесса)6) обрабатывать, подвергать обработке7) подвергать анализу, анализировать•to design process — разрабатывать технологию-
acetone-acetylene process
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acetylene process
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Acheson process
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acid Bessemer process
-
acid process
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acid reclaiming process
-
acyclic process
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Adapti investment casting process
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additive process
-
adiabatic process
-
Aero case process
-
aerobic process
-
age-dependent process
-
air blast process
-
air-sand process
-
Alcan process
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Al-Dip process
-
alfin process
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alkali reclaiming process
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alkaline process
-
Allis-Chalmers agglomeration reduction process
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ALT process
-
aluminothermic process
-
anaerobic process
-
anamorphotic process
-
annealing-in-line process
-
anode process
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anodic electrode process
-
AOD process
-
aqua-cast process
-
ARBED-ladle-treatment process
-
arc-air process
-
arc-remelting process
-
argon-oxygen-decarburization process
-
ASEA-SKF process
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autoregressive process
-
averaging process
-
Azincourt process
-
azo coupling process
-
background process
-
bag process
-
BAP process
-
Barrow process
-
Basett process
-
basic Bessemer process
-
basic oxygen process
-
basic process
-
basic-arc process
-
batch process
-
biofiltration process
-
bipolar process
-
bipolar-FET process
-
bipolar-MOS process
-
BISRA degassing process
-
black-heart process
-
Blackodising process
-
blast-furnace process
-
Blaw-Knox process
-
bleaching process
-
Bochumer-Verein process
-
boiling process
-
bonding process
-
bottom-argon-process process
-
broadband random process
-
bromoil transfer process
-
bromoil process
-
bubble-column process
-
bubble-hearth process
-
buffer-slag process
-
Calmes process
-
Canadizing process
-
carbon mold process
-
carbon process
-
carbon-arc process
-
carbon-in-leach process
-
carbon-in-pulp process
-
carbothermic process
-
carbro process
-
carrier-gas degassing process
-
cascade process
-
cast shell process
-
catalytic DENO process
-
cathodic process
-
CC-CR process
-
CC-DR process
-
CC-HCR process
-
cementation process
-
cementation-in-pulp process
-
cementing process
-
centrifugal spinning process
-
cermet process
-
CESM process
-
CEVAM process
-
charge transfer process
-
chemical vapor deposition process
-
chemical-bonding process
-
Chenot process
-
china process
-
cine exposure process
-
cine process
-
CLC process
-
clean burn process
-
cloudburst process
-
CLU process
-
CMOS process
-
CNC process
-
CO2 silicate process
-
coal reduction process
-
coal to gas process
-
coal-gas-sumitomo process
-
coal-oxygen-injection process
-
COIN process
-
cold box process
-
cold doping process
-
cold process
-
cold scrap process
-
cold type process
-
collodion process
-
color process
-
concurrent processes
-
consteel process
-
consumable electrode vacuum arc melting process
-
contact process
-
continuous annealing process
-
continuous casting-cleaning rolling process
-
continuous casting-direct rolling process
-
continuous casting-hot charging and rolling process
-
continuous electroslag melting process
-
continuous metal cast process
-
continuous-on-line control process
-
continuous-time process
-
controlled pressure pouring process
-
controlled process
-
converter process
-
cooking process
-
coppering process
-
copying process
-
coupled cathodic-anodic process
-
cracking process
-
Creusot Loire Uddenholm process
-
critical process
-
cumulative process
-
cuprammonium process
-
curing process
-
CVD process
-
cyclic process
-
Cyclosteel process
-
Czochralski process
-
daguerre photographic process
-
dense-media process
-
Desco process
-
deterministic process
-
developing process
-
DH degassing process
-
diabatic process
-
diazo process
-
diffused planar process
-
diffusion process
-
diffusion transfer process
-
dip-forming process
-
direct iron process
-
direct process
-
direct reduction process
-
direct-sintering process
-
discrete-time process
-
discrete process
-
DLM process
-
Domnarvet process
-
Dored process
-
double-crucible process
-
double-epi process
-
doubling process
-
D-process
-
DR process
-
drop-molding process
-
dry adiabatic process
-
dry process
-
dry-blanch-dry process
-
duplex process
-
easy drawing process
-
EBM process
-
EBR process
-
EF-AOD process
-
electric furnace-argon oxygen decarburization process
-
electroarc process
-
electrocatalytic process
-
electrocolor process
-
electrodialysis reversal process
-
electroflux-remelting process
-
electromembrane process
-
electron-beam-melting process
-
electron-beam-refining process
-
electrophotoadhesive process
-
electrophotographic process
-
electroslag refining process
-
electroslag remelting process
-
electroslag remelt process
-
electrostatographic process
-
electrostream process
-
Elo-Vac process
-
elquench process
-
endothermic process
-
energy efficient process
-
entropy process
-
enzymatic process
-
EPIC process
-
epidemic process
-
epitaxial growth process
-
epitaxy growth process
-
ergodic process
-
ESR process
-
Estel process
-
etching process
-
exoergic process
-
exothermic process
-
extrusion-molded neck process
-
ferroprussiate process
-
Ferrox process
-
filming process
-
filtration-chlorination process
-
Finkl-Mohr process
-
FIOR process
-
first process
-
fixed-bed MTG process
-
flash steel direct reduction process
-
float process
-
float-and-sink process
-
float-zone process
-
flow process
-
fluid iron ore reduction process
-
fluid-bed MTG process
-
fluidized roasting process
-
fluid-sand process
-
FMC coke process
-
foaming process
-
foehn process
-
food-machinery and chemical coke process
-
foreground process
-
Foren process
-
FOS process
-
freeze concentration process
-
fuel-oxygen-scrap process
-
full-mold process
-
fusion-casting process
-
Futacuchi process
-
Gaussian process
-
Gero mold degassing process
-
Gero vacuum casting process
-
GGS process
-
girbitol process
-
gradual reduction process
-
growing process
-
growth process
-
gypsum-sulfuric acid process
-
Hall electrolytic process
-
Harris process
-
hazardous process
-
H-coal process
-
heat-transfer process
-
heavy-media process
-
hibernating process
-
HI-GAS process
-
high-frequency induction process
-
HIP process
-
H-iron process
-
Hoope process
-
hot isostatic pressing process
-
hot process
-
hot-metal process
-
hot-metal-and-scrap process
-
hot-type process
-
hydrogasification process
-
hydrotype process
-
HyL process
-
IC-DR process
-
image process
-
imbibition process
-
immiscible displacement process
-
implantation process
-
impurity doping process
-
in-bulk process
-
inchrome process
-
in-draw process
-
inductoslag-melting process
-
ingot casting direct rolling process
-
injection molding process
-
in-line process
-
Inred process
-
interpolation process
-
investment process
-
ion-implantation process
-
irreversible process
-
isentropic process
-
ISM process
-
isobaric process
-
isochoric process
-
isoenthalpic process
-
isoentropic process
-
isometric process
-
isoplanar process
-
isothermal process
-
iterative process
-
jet-expanding process
-
Kaldo process
-
katadyn process
-
Kawasaki-bottom-oxygen-process process
-
Kawasaki-Gas-Lime-Injection process
-
K-BOP process
-
KEK process
-
KG-LI process
-
kiln-reduction process
-
KIVCET cyclone smelting process
-
KIVCET process
-
knit-deknit process
-
koetherizing process
-
KR process
-
kraft process
-
lance bubbling equilibrium process
-
LBE process
-
LD-AB process
-
LD-AC process
-
LD-AOD process
-
LD-argon bottom process
-
LD-argon oxygen decarburization process
-
LD-CB process
-
LD-circle lance process
-
LD-CL process
-
LD-combination blow process
-
LD-HC top and botton blowing process
-
LDK process
-
LD-Kawasaki-Gas process
-
LD-KG process
-
LD-OB process
-
LD-OTB process
-
LD-oxygen bottom process
-
LD-oxygen-top-bottom process
-
lift-off process
-
liquefaction process
-
liquid gas plug process
-
liquid-phase process
-
loop transfer process
-
lost core process
-
low-waste technological process
-
LSI process
-
LVR process
-
LVS process
-
Mannesmann powder process
-
mapping process
-
Markovian process
-
Markov process
-
masking process
-
matte fuming process
-
melting process
-
mercast process
-
Midland-Ross process
-
Midrex process
-
migration process
-
miscible displacement process
-
miscible plug process
-
mixed autoregressive-moving average process
-
moist adiabatic process
-
Molynutz process
-
monochrome process
-
monolithic process
-
MOS process
-
MOSFET process
-
motion-picture process
-
moving average process
-
narrowband random process
-
Neely process
-
negative-positive process
-
Nitemper process
-
no pickle process
-
nonflow process
-
non-Gaussian process
-
Nord-Fuvo process
-
Nu-iron process
-
OBM process
-
OG process
-
OLP converter process
-
one-way process
-
open-hearth process
-
orbitread process
-
ore process
-
Orthoflow cracking process
-
Orthoforming process
-
orthogonal increment process
-
oxidation process
-
oxide-isolated process
-
oxygen-blow process
-
oxygen-gas process
-
oxygen-lancing process
-
oxygen-steelmaking process
-
packaging process
-
pad-batch dyeing process
-
pad-dry dyeing process
-
pad-jig dyeing process
-
pad-roll dyeing process
-
pad-steam dyeing process
-
pad-steam vat-print process
-
PAMCO-hot-alloy process
-
parent process
-
PCR process
-
Perrin process
-
PHA process
-
phonon process
-
photoelectric process
-
photomechanical process
-
photovoltaic process
-
pig iron-scrap process
-
pig-and-ore process
-
pigment padding dying process
-
pigment padding process
-
pigment process
-
pinatype process
-
planar process
-
plasma etching process
-
plasma etch process
-
plasma process
-
plasma-arc process
-
Plasmamelt process
-
Plasmared process
-
plaster mold process
-
plastic wirecut process
-
polytropic process
-
powder silicon ribbon process
-
power-press process
-
prepolymer process
-
prepress processes
-
pressure-driven membrane process
-
primuline process
-
propane-acid process
-
pulsating mixing process
-
Purex process
-
pushbench process
-
Q-BOP process
-
QDT process
-
quality basic oxygen process process
-
quasi-independent processes
-
quick and direct tapping process
-
ram process
-
random process
-
rapid solidification plasma deposition process
-
rayon continuous process
-
receiving process
-
reclamator reclaiming process
-
recurrent process
-
redox process
-
reducing process
-
reduction-smelting process
-
relaxation process
-
repetitive process
-
reproduction process
-
reversal process
-
reversible process
-
RH process
-
RH-OB process
-
ribbon process
-
R-N direct-reduction process
-
roasting-sintering process
-
roast-leaching process
-
robot-controlled process
-
rongalit-potash process
-
rotor process
-
rustless process
-
sample process
-
schoop process
-
scrap-and-pig process
-
scrap-conditioning process
-
scrap-ore process
-
screen printed process
-
self-developing process
-
self-healing process
-
semibatch process
-
semiconductor process
-
sending process
-
Sendzimir coating process
-
sequential process
-
silicon-gate MOS process
-
silicon-gate process
-
silk-screen process
-
single-pumpdown process
-
SIP process
-
skein spinning process
-
Skinner multiple-hearth process
-
slag minimum process
-
slip-casting process
-
slow down process
-
SLPM process
-
SL-RN metallization process
-
SL-RN reduction process
-
solid source diffusion process
-
solution regrowth process
-
solvent extraction-electrowinning process
-
solvent plug process
-
SOS process
-
spin-draw-texturizing process
-
spinylock process
-
sponge iron process
-
spontaneous process
-
Stanal process
-
stationary random process
-
STB process
-
steady-flow process
-
steam-blow process
-
steelmaking process
-
Stelmor process
-
step and repeat process
-
stochastic process
-
stuffer box process
-
submerged arc process
-
subtractive process
-
suck-and-blow process
-
Sulf BT process
-
Sulfinuz process
-
Sumitomo-slag all recycling process
-
Sumitomo-top-bottom process
-
Sursulf process
-
system process
-
TBM process
-
T-die process
-
Technamation process
-
thermal DeNOx process
-
Therm-i-Vac process
-
Thermo-Flow process
-
thermoplastic process
-
Thomas process
-
Thorex process
-
three-color process
-
Thyssen-blast-metallurgy process
-
Tifran process
-
tightly coupled processes
-
time-varying process
-
trichromatic process
-
triplex process
-
Tropenas converter process
-
Tufftride process
-
Tufftride TF1 process
-
uncertain process
-
user process
-
vacuum arc remelting process
-
vacuum casting process
-
vacuum deoxidation process
-
vacuum induction refining process
-
vacuum stream-droplet process
-
vacuum-arc degassing process
-
vacuum-carbodeoxidation process
-
vacuum-carbonate process
-
vacuum-induction melting process
-
vacuum-melting process
-
vacuum-metallothermic process
-
vacuum-oxygen-decarburization process
-
VAD process
-
VAR process
-
VAW process
-
VHSIC process
-
vigom process
-
VIR process
-
viscose process
-
visual process
-
VLSI process
-
VOD process
-
waiting process
-
water gas process
-
waterfall process
-
wet process
-
white-heart process
-
Zinal process
-
zinc distilling process -
12 technology
1) техника2) технология•-
additive technology
-
adhesive technology
-
advanced technology
-
aerocapture technology
-
alternative technology
-
analog technology
-
appropriate technology
-
artificial intelligence technology
-
bi-FET technology
-
bi-MOS technology
-
bipolar technology
-
bubble technology
-
bumping technology
-
buried channel MOS technology
-
capacitance-sensing technology
-
capacitance technology
-
circuit technology
-
CMDS technology
-
CMOS technology
-
coal technology
-
coil box technology
-
cold-storage technology
-
combined water-jetting and slurry-pumping technology
-
communications technology
-
communication technology
-
compatible technologies
-
complementary metal-dielectric technology
-
complementary metal-oxide-semiconductor technology
-
computer technology
-
computer/robotic technology
-
containerless technology
-
cryogenic technology
-
current technology
-
customized technology
-
custom technology
-
digital technology
-
display technology
-
double-diffusion technology
-
double-epitaxial technology
-
double-implantation technology
-
double-implant technology
-
double-polysilicon technology
-
double-poly technology
-
dry technology
-
ECL technology
-
electrical technology
-
electron-beam technology
-
electronic technology
-
environmentally appropriate technology
-
epiplanar technology
-
faulty technology
-
film technology
-
full-slice technology
-
fusing technology
-
gallium arsenide technology
-
gate-array technology
-
geotextile technology
-
heat technology
-
high technology
-
high-density technology
-
high-end technology
-
high-speed technology
-
high-temperature technology
-
high-waste technology
-
hybrid technology
-
hydraulic boring-and-reaming technology
-
hydraulic technology
-
IC technology
-
industrial robot technology
-
information-processing technology
-
information technology
-
innovative technology
-
integrated-circuit technology
-
integrated technology
-
ion-beam technology
-
isoplanar technology
-
jet cutting technology
-
knitting technology
-
latex technology
-
leading-edge technology
-
lithographic technology
-
local oxidation technology
-
low-end technology
-
low-temperature technology
-
low-waste technology
-
LSI technology
-
management technology
-
master-slice technology
-
metal-insulator-semiconductor technology
-
metallization technology
-
metallized semiconductor gate technology
-
metal-nitride-oxide-semiconductor technology
-
metal-oxide-semiconductor technology
-
microcircuit technology
-
microfabrication technology
-
microprocessor technology
-
microwave technology
-
mining technology
-
MIS technology
-
mixed technology
-
mixed-signal technology
-
MNOS technology
-
modulation doping technology
-
monorail technology
-
MOS technology
-
NC machining technology
-
NC technology
-
n-channel technology
-
nonwaste technology
-
nuclear energy technology
-
optical lithographic technology
-
packaging technology
-
p-channel technology
-
photolithographic technology
-
photoprocessing technology
-
photoresist-processing technology
-
planar technology
-
plasma technology
-
polysilicon self-aligned technology
-
polysilicon-gate isolation technology
-
premining technology
-
presser-foot technology
-
radar-rainfall technology
-
recording technology
-
redundancy technology
-
robotics technology
-
rolling technology
-
rubber technology
-
scaled technology
-
Schottky TTL technology
-
self-aligned technology
-
semiconductor technology
-
semirecessed oxide technology
-
sensor technology
-
silicon technology
-
silicon-gate technology
-
silicon-on-insulator technology
-
silicon-on-sapphire technology
-
single-diffusion technology
-
SL-DC technology
-
soft energy technologies
-
software technology
-
solar technology
-
solid-state technology
-
state-of-the-art technology
-
step-and-repeat technology
-
submicron technology
-
subtractive technology
-
surface-mounting technology
-
surface-mount technology
-
systematization technology
-
tape automated bonding technology
-
television technology
-
thick-film technology
-
thin-film technology
-
tire technology
-
triple-diffusion technology
-
TTL technology
-
underwater technology
-
vacuum technology
-
vapor-phase technology
-
video tape technology
-
VLSI technology
-
warp knitting technology
-
wasteless technology
-
water jet boring-and-reaming technology
-
well-proven technology -
13 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
14 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
-
15 layer
2) горн. пласт7) вчт. уровень ( иерархической структуры)•layer free from base — кфт. бесподложечный слой-
ablation layer
-
absorbed layer
-
acceptor layer
-
accumulation layer
-
adsorbed layer
-
alignment layer
-
amorphous layer
-
anode layer
-
antihalation layer
-
antireflection layer
-
antireflective layer
-
antistatic layer
-
Appleton layer
-
application layer
-
as-grown layer
-
atmospheric boundary layer
-
back layer
-
backing layer
-
back-up layer
-
ballast layer
-
barrier layer
-
base layer
-
batch layer
-
blending layer
-
blocking layer
-
bottom layer
-
boundary layer
-
buffer layer
-
buried layer
-
cable layer
-
cap layer
-
cathode interface layer
-
cathode layer
-
chalcogenide layer
-
Chapman layer
-
chemisorption layer
-
chilling layer
-
chill layer
-
cladding layer
-
clad layer
-
cloud layer
-
cloud-topped boundary layer
-
coal layer
-
coil layers
-
collector layer
-
composite layer
-
compression layer
-
concentric layers
-
conducting layer
-
confining layer
-
contact layer
-
continuous layer
-
convective unstable layer
-
covering layer
-
cushion layer
-
D layer
-
dan layer
-
dead layer
-
depletion layer
-
deposited layer
-
diamond-bearing layer
-
dielectric layer
-
diffused layer
-
diffusion-source layer
-
dipole layer
-
dislocation layer
-
doped layer
-
drain layer
-
driving layer
-
dueling layer
-
dummy layer
-
dust layer
-
E layer
-
effective layer
-
elastomer layer
-
elevated layer
-
embedded metal layer
-
emitter layer
-
emitting layer
-
emulsion layer
-
enriched layer
-
epitaxial layer
-
epoxy layer
-
evaporated layer
-
extension layer
-
F layer
-
fettled layer
-
field oxide layer
-
filter layer
-
fog layer
-
gate insulation layer
-
ground layer
-
gunned layer
-
hanging layer
-
heat-insulating layer
-
Heaviside layer
-
heavy layer
-
high-concentration layer
-
high-mobility layer
-
hydraulic fill layer
-
image receiving layer
-
impurity layer
-
insulating layer
-
interface layer
-
intermediate layer
-
intrinsic layer
-
inversion layer
-
ion-implanted layer
-
ionized layer
-
ionospheric layer
-
Kennelly-Heaviside layer
-
light-sensitive layer
-
link layer
-
low-emission layer
-
low-mobility layer
-
masking layer
-
metallic layer
-
metallization layer
-
moderating layer
-
monoatomic layer
-
monocrystalline layer
-
monomolecular layer
-
multiple layer
-
n layer
-
native layer
-
negative layer
-
network layer
-
neutral layer
-
nonconducting layer
-
nonducting layer
-
nucleating layer
-
oceanic mixed layer
-
ohmic layer
-
oil layer
-
ozone layer
-
p layer
-
paper layer
-
passivation layer
-
photoconductive layer
-
photographic layer
-
photosensitive layer
-
physical layer
-
physisorption layer
-
planarization layer
-
planetary boundary layer
-
plank layer
-
polycrystalline silicon layer
-
poly silicon layer
-
presentation layer
-
protective layer
-
receiving layer
-
restraining layer
-
sandwiched layer
-
scattering layer
-
scuff resisting layer
-
sealing layer
-
seal layer
-
semiconducting layer
-
separation layer
-
session layer
-
shallow diffused layer
-
shallow layer
-
sintered layer
-
slag-impregnated surface layer
-
solvent layer
-
sporadic-E layer
-
sputtered layer
-
sputter layer
-
stratified layers
-
strip layers
-
subbing layer
-
subcloud layer
-
substrate layer
-
subsurface layer
-
superconducting layer
-
supernatant layer
-
surface layer
-
thermal boundary layer
-
transition layer
-
transmission control layer
-
transparent layer
-
transport layer
-
trapping layer
-
tropospheric layer
-
turbulent boundary layer
-
underglaze layer
-
undoped layer
-
unsteady boundary layer
-
velocity boundary layer
-
velocity layer
-
wall boundary layer
-
wearing layer
-
web cross layers
-
wind-mixed layer
-
wire reinforcement layer
-
wiring layer -
16 contact
1. ім.1) контакт2. дієсл. контактувати - base contact
- beam-lead contact
- bifurcated contact
- blocking contact
- bonded contact
- bump contact
- buried contact
- crimp contact
- edge-board contact
- excimer-laser mixed contact
- hard contact
- injection contact
- ion-implanted contact
- low-resistance contact
- metallization contact
- metal-semiconductor contact
- MIS contact
- nonohmic contact
- nonrectifying [ohmic] contact
- point contact
- polysilicon-to-diffusion contact
- protruding contact
- rectifying contact
- resistance contact
- Schottky-barriercontact
- Schottkycontact
- Schottky base contact
- soft contact
- soldered contact
- substrate contact
- vacuum contact
- welded contact -
17 mask
1. ім.1) фотошаблон; шаблон; (вільна) маска; трафарет2) маска, маскуючий шар2. дієсл. маскувати - artwork mask
- base-region mask
- base mask
- base-resistor mask
- bimetal mask
- blocking mask
- chrome mask
- collector mask
- composite mask
- contact-area mask
- contact mask
- contact-print additional mask
- custom mask
- deep UV mask
- delineation mask
- deposition mask
- diffusion mask
- doping mask
- dry film solder mask
- E-beam mask
- E-chrome mask
- electron-beam generated mask
- emitter mask
- emulsion mask
- etch ing mask
- etch mask
- etch-resistantmask
- etch-resistmask
- evaporation mask
- exposure mask
- fault injection mask
- faultless mask
- field-oxidemask
- fieldmask
- fine-line mask
- gold mask
- grid mask
- hard-surface mask
- high-contrast X-ray mask
- high-flatness mask
- high-transmission X-ray mask
- IC mask
- in situ mask
- insulator mask
- interconnection mask
- ion-beam stencil mask
- ion-implantation mask
- iron-oxide mask
- isolation mask
- layered mask
- lithographic mask
- master mask
- metal mask
- metal etched mask
- metallization etching mask
- metal-on-glass mask
- metal-on-polymer mask
- moving mask
- multi-pinhole mask
- native охide mask
- negative mask
- nonerodible mask
- offset mask
- optical mask
- optical gate mask
- overlaid mask
- oxidation mask
- oxygen-impermeable mask
- pattern mask
- pattern transfer mask
- photolithographic mask
- photoresist mask
- plating mask
- production mask
- programmingmask
- programmask
- projection mask
- p-well mask
- quartz mask
- refractory mask
- resistor-body mask
- reticle mask
- self-aligned mask
- sputter mask
- stencil mask
- step-and-repeat mask
- thick-film screen mask
- thin-film mask
- trench mask
- vacuum-deposition mask
- work mask
- X-ray lithography mask
- X-ray mask
- 1x mask
- 1:1 mask -
18 masking
1) маскування 2) літографія - dry masking
- metallization masking
- nitride masking
- optical masking
- oxidation masking
- oxide masking
- photo masking
- photoresist masking
- projection masking
- reticle masking
- selective photoresist masking
- selective masking
- silicon-dioxide masking
- wet masking -
19 layer
1) слой; плёнка || формировать слой или слои; наносить плёнку2) прокладка; разделительный слой || использовать прокладку; разделять слоем3) расслаивать(ся); отслаиваться4) вчт уровень || вводить уровни; использовать многоуровневое представление (напр. иерархической системы)5) уровень шифрования, один из (последовательно применяемых неидентичных) шагов шифрования ( в блочных шифрах)•- layer of weaker air movement
- layer of weights
- accumulation layer
- adhesion layer
- Appleton layer
- application layer - barrier layer
- base layer
- Beilby layer
- blocking layer
- bonding layer
- bottom layer
- boundary layer
- buried layer
- cathode layer
- Chapman layer
- charge layer
- collector layer
- competitive layer
- confusion layer
- control layer
- D-layer
- data-link layer
- daytime layer
- dead layer
- depletionlayer
- deposited layer
- diffusion layer
- dipole layer
- doped layer
- ducting layer
- E-layer
- Es layer
- electroluminescent powder layer
- electron-barrier layer
- elevated layer
- embedded metal layer
- emitter layer
- enriched layer
- epitaxial layer
- evaporation layer
- F-layer
- F1 layer
- F2 layer
- fencing layer
- fused layer
- Gaussian-doped layer
- gettering layer
- Grossberg layer
- half-value layer - heteroepitaxial layer
- hidden layer of neural network
- hole-barrier layer
- homoepitaxial layer
- i-layer
- implanted layer
- input layer of neural network
- interfacial layer
- intrinsic layer
- inversion layer
- ion-implanted layer
- Kennelly-Heaviside layer
- Kohonen layer
- light-blocking layer
- link layer
- liquid-crystal layer
- low-latitude boundary layer
- metal layer
- metallization layer
- microtwinned layer
- microvia layer
- momentum boundary layer
- n-layer
- narrow band-gap layer
- near-intrinsic layer
- network layer
- neural layer
- optical waveguiding layer
- output layer of neural network
- overgrown layer
- oxide layer
- ozone layer
- p-layer
- passivation layer
- phosphor layer
- photoconductive control layer
- physical layer
- pi layer
- plasma sheet boundary layer
- polysilicon layer
- presentation layer
- recording layer
- secure sockets layer
- self-assembled layer
- semi-transparent layer
- sensor layer
- separating layer
- session layer
- signal layer
- space-charge layer
- spontaneous inversion layer
- sporadic-E layer
- surface boundary layer
- swept-out layer
- transaction layer
- transition layer
- transport layer
- tropospheric layer
- unswept layer
- unswept epitaxial layer
- vacuum-deposited layer
- vacuum-evaporated layer
- wide band-gap layer
- wiring layer
- ν-layer
- π-layer -
20 layer
1) слой; плёнка || формировать слой или слои; наносить плёнку2) прокладка; разделительный слой || использовать прокладку; разделять слоем3) расслаивать(ся); отслаиваться4) вчт. уровень || вводить уровни; использовать многоуровневое представление (напр. иерархической системы)5) уровень шифрования, один из (последовательно применяемых неидентичных) шагов шифрования ( в блочных шифрах)•- ν layer- π layer
- accumulation layer
- adhesion layer
- Appleton layer
- application layer
- ATM adaptation layer
- atom layer
- barrier layer
- base layer
- Beilby layer
- blocking layer
- bonding layer
- bottom layer
- boundary layer
- buried layer
- cathode layer
- Chapman layer
- charge layer
- collector layer
- competitive layer
- confusion layer
- control layer
- D layer
- data-link layer
- daytime layer
- dead layer
- depletion layer
- deposited layer
- diffusion layer
- dipole layer
- doped layer
- ducting layer
- E layer
- Es layer
- electroluminescent powder layer
- electron-barrier layer
- elevated layer
- embedded metal layer
- emitter layer
- enriched layer
- epitaxial layer
- evaporation layer
- F layer
- F2 layer
- F1 layer
- fencing layer
- fused layer
- Gaussian-doped layer
- gettering layer
- Grossberg layer
- half-value layer
- hardware abstraction layer
- Heaviside layer
- heteroepitaxial layer
- hidden layer of neural network
- hole-barrier layer
- homoepitaxial layer
- i layer
- implanted layer
- input layer of neural network
- interfacial layer
- intrinsic layer
- inversion layer
- ion-implanted layer
- Kennelly-Heaviside layer
- Kohonen layer
- layer of units
- layer of weaker air movement
- layer of weights
- light-blocking layer
- link layer
- liquid-crystal layer
- low-latitude boundary layer
- metal layer
- metallization layer
- microtwinned layer
- microvia layer
- momentum boundary layer
- n layer
- narrow band-gap layer
- near-intrinsic layer
- network layer
- neural layer
- optical waveguiding layer
- output layer of neural network
- overgrown layer
- oxide layer
- ozone layer
- p layer
- passivation layer
- phosphor layer
- photoconductive control layer
- physical layer
- pi layer
- plasma sheet boundary layer
- polysilicon layer
- presentation layer
- recording layer
- secure sockets layer
- self-assembled layer
- semi-transparent layer
- sensor layer
- separating layer
- session layer
- signal layer
- space-charge layer
- spontaneous inversion layer
- sporadic-E layer
- surface boundary layer
- swept-out layer
- transaction layer
- transition layer
- transport layer
- tropospheric layer
- unswept epitaxial layer
- unswept layer
- vacuum-deposited layer
- vacuum-evaporated layer
- wide band-gap layer
- wiring layerThe New English-Russian Dictionary of Radio-electronics > layer
См. также в других словарях:
diffusion metallization — difuzinis metalizavimas statusas T sritis chemija apibrėžtis Metalo paviršiaus įsotinimas (dengimas) kitais metalais, pagrįstas jų difuzija iš aplinkos aukštoje temperatūroje. atitikmenys: angl. diffusion metallization rus. диффузионная… … Chemijos terminų aiškinamasis žodynas
difuzinis metalizavimas — statusas T sritis chemija apibrėžtis Metalo paviršiaus įsotinimas (dengimas) kitais metalais, pagrįstas jų difuzija iš aplinkos aukštoje temperatūroje. atitikmenys: angl. diffusion metallization rus. диффузионная металлизация … Chemijos terminų aiškinamasis žodynas
диффузионная металлизация — difuzinis metalizavimas statusas T sritis chemija apibrėžtis Metalo paviršiaus įsotinimas (dengimas) kitais metalais, pagrįstas jų difuzija iš aplinkos aukštoje temperatūroje. atitikmenys: angl. diffusion metallization rus. диффузионная… … Chemijos terminų aiškinamasis žodynas
Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… … Wikipedia
Elektronenmigration — Unter Elektromigration (EM) versteht man einen Materialtransport durch allmähliche Bewegung von Ionen in einem festen Leiter, der durch den elektrischen Strom verursacht wird. Kollisionen von Elektronen mit den Ionen und in geringerem Maß auch… … Deutsch Wikipedia
Elektromigration — Unter Elektromigration (EM) versteht man einen Materialtransport durch allmähliche Bewegung von Ionen in einem festen Leiter, der durch den elektrischen Strom verursacht wird. Kollisionen von Elektronen mit den Ionen und in geringerem Maß auch… … Deutsch Wikipedia
Power MOSFET — A Power MOSFET is a specific type of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to handle large power. Compared to the other power semiconductor devices (IGBT, Thyristor...), its main advantages are high commutation speed … Wikipedia
Memristor — Type Passive Working principle Memristance Invented Leon Chua (1971) First production HP Labs (2008) Electronic symbol … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Eddy current — This article is about the electrical phenomenon. For the Ted McKeever comic, see Eddy Current (comics). Electromagnetism … Wikipedia
Barrier metal — A barrier metal is a material used in integrated circuits to chemically isolate semiconductors from soft metal interconnects, while maintaining an electrical connection between them. For instance, a layer of barrier metal must surround every… … Wikipedia
